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D-Sub高體積密度接觸器AMPHENOL

公布的時間：2023-09-06 16:40:00     搜索：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高(gao)黏度相連器圓角PCB線接(jie)有(you)倆種(zhong)封裝類型戰略(lve)(lve)布局(ju)種(zhong)類：南美洲設(she)(she)計方案和軍用用戰略(lve)(lve)布局(ju)。配(pei)上模塊接(jie)觸(chu)面上要自始至(zhi)終為杏淡(dan)黃色，能基(ji)于需(xu)要備(bei)考要的比較充(chong)足(zu)配(pei)上頻次選取(qu)兩類大多板厚(hou)：閃爍金、15μ"和30μ"。玩點能夠(gou)(gou)帶來了(le)高(gao)精密機械制(zhi)造設(she)(she)備(bei)加(jia)(jia)工(gong)廠的航天軍工(gong)用級板本(ben)（特(te)殊直流電高(gao)至(zhi)7.5A）以服務健康(kang)安(an)全耐(nai)用性，也要夠(gou)(gou)出(chu)示更(geng)第(di)三產業且可商用機的額定功率功率為3A的沖壓加(jia)(jia)工(gong)版本(ben)號。

D-Sub高(gao)(gao)相(xiang)對密(mi)度(du)聯接器標準規定全(quan)系(xi)列(lie)常(chang)從A到E的(de)5種一(yi)般機(ji)身型(xing)號，AMPHENOL的(de)交織聯系(xi)器在(zai)(zai)數值預警、24v電源和同軸電纜(lan)電線(xian)因素享(xiang)有達18個玩點(dian)的(de)分布(bu)。堆疊（雙(shuang)表層）D-Sub密(mi)度(du)高(gao)(gao)計算公式(shi)銜接器車輛(liang)產(chan)品系(xi)列(lie)一(yi)定豐富多彩。AMPHENOL新建發的(de)做為PIP焊結細長(chang)（或(huo)(huo)沉(chen)式(shi)或(huo)(huo)短型(xing)）系(xi)列(lie)產(chan)品在(zai)(zai)AMPHENOL的(de)房(fang)地產(chan)業大家中賺取追求成(cheng)功。除此(ci)諸(zhu)如此(ci)類，AMPHENOL還可能為其他使(shi)用作為機(ji)，是指金屬件蓋、塑(su)料制品防(fang)爆蓋、自我保護(hu)罩、裝配機(ji)、單雙(shuang)眼皮轉化和一(yi)些適用器。

表現形式

的標準(zhun)D形連(lian)結器

EMI合金(jin)金(jin)屬外(wai)殼(ke)

電源線接地保護(hu)器凹坑

插(cha)人件(jian)由阻燃型熱塑性(xing)塑膠變形塑膠拍攝(she)而成(cheng)

使用房地產(chan)業章印碰到點

兼具全定位(wei)線接(jie)的范(fan)圍的變體

各(ge)種各(ge)樣的線(xian)接(jie)的規格均給出電(dian)源(yuan)插座和插座

優勢

提高認(ren)識精(jing)準的聽取位(wei)置

首要中用自動(dong)生產的但縮(suo)減制造費的解決(jue)處理方法

UL#E232356認(ren)正(zheng)

兼容多種用戶組需(xu)求分析

適用標規范性

獨特系(xi)列的最適合于管(guan)腳焊(han)錫(xi)膏(gao)或流回氬弧焊(han)

成都(dou) 市立(li)維創展技術(shu)一級(ji)代(dai)理(li)供應商(shang)(shang)AMPHENOL公司的(de)其他層面(mian)物料系列產(chan)品，在(zai)AMPHENOL，AMPHENOL信任在(zai)開始(shi)業(ye)務(wu)(wu)領域的(de)工作(zuo)中(zhong)修出(chu)可(ke)一直的(de)確定能夠為投資人創造(zao)出(chu)短時(shi)間和(he)長(chang)年(nian)價(jia)值。AMPHENOL的(de)每個(ge)項(xiang)服務(wu)(wu)都(dou)積極(ji)于持續(xu)不斷的(de)改進方(fang)案(an)其設(she)計方(fang)案(an)，采(cai)購(gou)管理(li)系統(tong)，生產(chan)和(he)交付使用服務(wu)(wu)的(de)的(de)方(fang)法，積極(ji)滿(man)足了或(huo)突破客(ke)對全價(jia)格(ge)鏈中(zhong)服務(wu)(wu)管理(li)系統(tong)的(de)期許。AMPHENOL 的(de)業(ye)務(wu)(wu)員將(jiang)安全保(bao)(bao)障和(he)大環境保(bao)(bao)證充(chong)當(dang)首(shou)先(xian)神(shen)器任務(wu)(wu)，并會根據ISO 14001和(he)OHSAS 18001等頂尖級(ji)原(yuan)則工作(zuo)那(nei)些方(fang)案(an)。如(ru)果，認可(ke)和(he)法律專業(ye)正規性還還不夠。AMPHENOL這樣不只要遵照法規標(biao)準就能創造(zao)經常商(shang)(shang)業(ye)價(jia)值。

寶貝詳情分析AMPHENOL可點(dian)擊：//www.imyme.cn/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


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